To deal with aging failure in high temperature and high humidity environments, it is necessary to start from multiple dimensions such as material selection, structural design, and process optimization.
In modern industrial manufacturing, electroplastic copper products are widely used in electronics, hardware, automobiles, architectural decoration and other fields due to their good conductivity, corrosion resistance and decorative properties.
In the field of modern electronic device manufacturing, copper electrode has become a key functional material due to its excellent conductivity and machinability.
When selecting a substrate for stamping, in order to ensure that the performance of the final electroplated copper products meets the expected standards, multiple factors must be considered comprehensively.
Copper electrode is widely used in many fields, and its performance is crucial to the operation of related processes and equipment.
Functionally graded structures can be formed by embedding conductive plastics or carbon fiber reinforced composites in a cast aluminum matrix.